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Research Interests:
Professor. Bozack main research interests lie in the study of gas- and metal-
surface reactions, semiconductor surfaces, thin films, ohmic and Schottky contact
development, semiconductor processing technology, wide bandgap electronics, liquid
metal alloy wetting, and Pb-free solder technology, and tin whiskers. Current work
focuses on the details of chemical reactions between liquid and solid surfaces. The
focus is to obtain a microscopic description of surface dynamic processes by exploring
the kinetics of surface reactions and the nature of the surface chemical bond.
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Biographic Sketch:
Michael J. Bozack received his B.S. and M.S. degrees in physics from Michigan State
University and a Ph.D. degree in applied physics from Oregon Health and Sciences
University (OHSU). At OHSU, he worked for Dr. Lynwood W. Swanson (founder of FEI
Corporation) and Dr. John S. Blakemore (of Solid State Physics and Semiconductor
Statistics fame) on the surface physics associated with B- and As-emitting liquid metal ion
sources.
Next, he was a Postdoctoral Research Associate in the Surface Science Center at the
University of Pittsburgh, where he performed pioneering experiments with Professors J. T.
Yates, Jr. and W. J. Choyke on Si and SiC surface chemistry, epitaxial growth, methods in
semiconductor surface chemistry, and electron-stimulated desorption (ESD and ESDIAD)
of F+ from Si(100) surfaces.
Later, he moved to Intel Corporation as chief surface scientist during development of the
386-486 (pre-Pentium) microprocessor. During this period the Materials Technology
Group at Intel experienced tremendous growth with the addition of nearly $20M of surface,
thin film, and materials instrumentation to support VLSI technology throughout Intel.
Currently, Dr. Bozack is Professor of Physics at Auburn University and Director of the AU
Surface Science Laboratory (AUSSL).
He was a nominee for the 1998 Michigan State University Outstanding Alumni Award and
won the 1997 Distinguished Alumni Award from Lansing Community College in Lansing,
MI. He was awarded the AU Alumni Undergraduate Teaching Excellence Award in 1997,
given to the top five professors at AU. In addition, he has won the AU Outstanding
Professor Award (1998) from the AU Panhellenic Council and was the Professor of the
Year in the AU College of Sciences and Mathematics (1995).
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Selected Publications:
Z. Cai, J. C. Suhling, P. Lall, M. J. Bozack, “Mechanical Behavior of Low Silver Content SAC
Alloys Optimized for Portable Electronics,” (submitted, IEEE Trans. Components and
Packaging Technologies).
Y. Zhou, C. Ahyi, T. I. Smith, M. J. Bozack, C. C. Tin, J. R. Williams, M. Park, A. Cheng, J. H.
Park, D. Kim, and D. Wang, “Formation, Etching, and Electrical Characterization of a
Thermally Grown Gallium Oxide on the Ga-Face of a Bulk GaN Substrate,” Solid-State
Electron. 52 (2008) 756.
R. Dean, J. Weller, M. J. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, J. Hetke,
“Realization of Ultra-Fine Pitch Traces on LCP Substrates,” IEEE Trans. Components and
Packaging Technologies 31 (2008) 315.
H. Ma, J. C. Suhling, P. Lall, and M. J. Bozack, “Reliability of the Aging Lead-Free Solder
Joint” (submitted, IEEE Trans. Components and Packaging Technologies).
J. L. Evans, C. Mitchell, M. J. Bozack, L. Payton, M. R. McQueeney, and J. R. Thompson,
“Reliability of SAC BGA Using Sn-37Pb Solder Paste for Harsh Environment Electronics,”
(submitted, IEEE Trans. Components and Packaging Technologies).
R. Dean, J. Weller, M. J. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, and J. Hetke,
"Novel Biomedical Implant Interconnects Utilizing Micromachined LCP" (submitted, J.
Microlithography, Microfabrication, and Microsystems).
G. T. Flowers, F. Xie, M. J. Bozack, X. Hai, B. Rickett, and R. D. Malucci, “A Study of the
Physical Characteristics of Vibration-Induced Fretting Corrosion” (submitted, IEEE Trans.
Components and Packaging Technologies).
D. Wang, H. W. Seo, C.-C. Tin, M. J. Bozack, J. R. Williams, M. Park, N. Sathitsuksanoh, An-
jen Cheng, and Y. H. Tzeng, “Effects of Post-Growth Annealing Treatments on the
Photoluminescence of ZnO Nanorods” (accepted, J. Appl. Phys.).
G. T. Flowers, F. Xie, M. J. Bozack, R. Horvath, R. D. Malucci, and B. Rickett “Vibration
Testing of Fretting Corrosion in Electrical Connectors Subjected to Multi-Frequency and
Random Spectral Profiles” (accepted, IEEE Trans. of Components and Packaging
Technologies).
R. Dean, J. Weller, M. J. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, and J. Hetke,
“Micromachined LCP Connectors for Packaging MEMS Devices in Biological
Environments,” J. Microelectronics and Electronics Packaging 4 (2007) 17.
J. A. Davis, M. J. Bozack and J. L. Evans, “Reliability Impact of (Au, Ni)Sn4 Growth on Sn-
37Pb/ENIG Solder Joints under Isothermal and Temperature-Cycled Conditions,” IEEE
Trans. Components and Packaging Technologies 30 (2007) 32.
D. Wang, H. W. Seo, Y. H. Tzeng, C. C. Tin, M. J. Bozack, J. R. Williams, and M. Park,
“Lasing in Whispering Gallery Mode in ZnO Nanonails” J. Appl. Phys. 99, 093112 (2006).
H. W. Seo, D. Wang, Y. Tzeng, N. Sathitsuksanoh, C. C. Tin, M. J. Bozack, J. R. Williams,
and M. Park, “Growth and Characterization of ZnO Nanonail,” Mater. Res. Soc. Symp. Proc.
829, B2.26 (2005).
K. W. Bryant and M. J. Bozack, “Monolayer Growth Modes of Nb and Re on 4H-SiC
Surfaces” J. Appl. Phys 97 (2005) 24904.
M. J. Bozack and R. W. Johnson, “Real-Time Scanning Electron Microscopy and Auger
Spectroscopy of Sn-3.3Ag-4.8Bi Solder Paste Wetted to Ni-Au,” J. Elect. Mater. 34 (2005)
248.
M. J. Bozack, “Real-Time Wetting Dynamics and Interfacial Chemistry in Low-Melting 57Bi-
42Sn-1Ag Solder Paste on Ni-Au,” J. Vac. Sci. Technol. A 22 (2004) 2223.
S. V. Sattiraju, B. Dang, R. W. Johnson, Y. Li, J. S. Smith, and M. J. Bozack, "Wetting
Characteristics of Pb-free Solder Pastes and Pb-free PWB Finishes," IEEE Transactions
on Electronics Packaging Manufacturing, Vol 25, July 2002, 168-184.
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